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| author | P. J. McDermott <pj@pehjota.net> | 2019-02-15 17:54:01 (EST) |
|---|---|---|
| committer | P. J. McDermott <pj@pehjota.net> | 2019-02-15 17:54:01 (EST) |
| commit | 85662048eabbc6c50af23db7028796d5c84a5f20 (patch) | |
| tree | 61ce73973fdc6d41757e7effaac1772ab25f4e87 /.Slic3r/print/SFF-8201 HA.ini | |
| parent | d34769be52d76e0a063e2592d3b4f638806b04f7 (diff) | |
| download | slic3r-85662048eabbc6c50af23db7028796d5c84a5f20.zip slic3r-85662048eabbc6c50af23db7028796d5c84a5f20.tar.gz slic3r-85662048eabbc6c50af23db7028796d5c84a5f20.tar.bz2 | |
eSUN PLA, 3 mm: Decrease extruder and bed temps
Bed adhesion is already strong even down to 45°C. Reducing the bed
temperature should help reduce minor elephant's foot. Reducing
temperatures also shaves minutes off the print time.
Diffstat (limited to '.Slic3r/print/SFF-8201 HA.ini')
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