From 85662048eabbc6c50af23db7028796d5c84a5f20 Mon Sep 17 00:00:00 2001
From: P. J. McDermott <pj@pehjota.net>
Date: Fri, 15 Feb 2019 17:54:01 -0500
Subject: eSUN PLA, 3 mm: Decrease extruder and bed temps

Bed adhesion is already strong even down to 45°C.  Reducing the bed
temperature should help reduce minor elephant's foot.  Reducing
temperatures also shaves minutes off the print time.
---
(limited to '.Slic3r/print/SFF-8201 HA.ini')

--
cgit v0.9.1