Commit message (Collapse) | Author | Age | Files | Lines | |
---|---|---|---|---|---|
* | eSUN PLA, 3 mm: Increase extruder temp back to 200 | P. J. McDermott | 2019-02-15 | 1 | -3/+3 |
| | | | | Solid infill is being underextruded. | ||||
* | eSUN PLA, 3 mm: Always enable fans | P. J. McDermott | 2019-02-15 | 1 | -2/+2 |
| | |||||
* | eSUN PLA, 3 mm: Decrease extruder and bed temps | P. J. McDermott | 2019-02-15 | 1 | -5/+5 |
| | | | | | | Bed adhesion is already strong even down to 45°C. Reducing the bed temperature should help reduce minor elephant's foot. Reducing temperatures also shaves minutes off the print time. | ||||
* | eSUN PLA, 3 mm: Slightly decrease temperature | P. J. McDermott | 2019-02-14 | 1 | -3/+3 |
| | |||||
* | eSUN PLA, 3 mm: Increase temperature | P. J. McDermott | 2019-02-14 | 1 | -3/+3 |
| | |||||
* | eSUN PLA, 3 mm: Increase temperature | P. J. McDermott | 2019-02-14 | 1 | -3/+3 |
| | |||||
* | eSUN PLA, 3 mm: Decrease temperature | P. J. McDermott | 2019-02-13 | 1 | -3/+3 |
| | |||||
* | filament: Rename "PLA, 3 mm" to "eSUN PLA, 3 mm" | P. J. McDermott | 2019-02-11 | 1 | -0/+17 |